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I Elprint benytter vi stadigvæk vores velkendte MIX-princip, hvor standardopbygninger af 1-, 2-, og 4-lags print bliver mixet med andre print, der bærer samme specifikationer. Hermed opnår du en bedre udnyttelse af produktionspanelet og der er flere til at ”deles” om opstartsomkostningerne. Dette medfører, at du som kunde får lavere priser på print, som kan mixes. Her på siden kan du se vores kapabilitet - både hvad angår standard printkort på mix og vores generelle kapabiliteter for alle typer af printkort.
For at dit print kan mixes, skal det opfylde nogle krav, som er specificeret i boksen umiddelbart herunder.
For flere tekniske oplysninger kan du med fordel læse nærmere om printkort her på siden eller på www.macaos.com.
Hent en printervenlig PDF af vores kapabiliteter.
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| Production time |
Minimum 2 days |
| Shipment time |
2 days |
| Base materials |
FR4
FR4 High TG
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| Product range |
1, 2 and 4 layer.
1.6 mm; 35 um copper in all layers.
4-layer have unspecified distance between layers.
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| Surface finish |
Lead-free HASL |
| Solder mask |
Color: Green
Bridge: 0.1 mm
Over size (C): 0.1 mm
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| Component printing |
White
Minimum 0.125 mm track width
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| Hole, minimum size (A) |
0.30 mm |
| Conductor width (D) |
0.125 mm |
| Conductor spacing (E) |
0.125 mm |
| Annular ring (B) |
0.15 mm |
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| A |
Finished hole size. Plated or non plated |
| B |
Annular ring: (pad size – hole size) / 2 |
| C |
Soldermask opening |
| D |
Conductor width |
| E |
Conductor spacing |
| F |
Solder mask bridge |
| G |
NPTH to copper |
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Standard |
Special |
| Production standard |
IPC 6012C, Class 2 |
IPC 6012C, Class 3
Perfag
Any special requirements
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| Production time |
5 days |
1-2 days |
| Shipment time |
2 days |
1 day. 3 days -3 weeks on series |
| Base materials |
FR4
FR4 High TG
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Rogers
Aluminium core/carrier
Polyimide (flex & rigid)
Arlon
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| Product Range |
Single sided, double sided
Multilayer
Prototypes
Small & large production series
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High density interconnect (HDI)
Flex, Rigid-Flex
Metal core/carrier (Alu)
Impedance controlled PCBs
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| Board size |
Min 25×25, if smaller PCB must be panelized
Max 500×600 mm
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Max 520-720 mm?? |
| PCB thickness |
1.6 mm standard, ± 10% |
FR4: 0.1 – 6.0 mm
Min. inner layer: 0.05 mm
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| Copper thickness |
35µ
Plating: 20µ for IPC Class 2
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12-200µ
Plating: 25µ for IPC Class 3
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| Surface finish |
Lead free HASL
ENIG (chem. NiAu)
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Silver
Chemical Tin
Hard Gold
HASL (Non RoHS, with lead)
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| Mechanical processing |
Routing (2.4, 2.0, 1.6 mm)
Routing tolerance: ±0.20 mm
Scoring (PCB thicnkess: 0.8-2.4 mm)
Scoring, min dist. Copper: 0.4 mm
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Min. routing tool: 0.6 mm dia.
Routing tolerance: ±0.10 mm
Plated edges
Depth controlled routing
Castellated holes (half moon holes)
Blind & buried vias
Peelable (blue) mask
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| Holes |
Mechanical: 0.25-6.2 mm
Aspect ratio Through hole: 1:10
Aspect ratio blind hole: 1:1
Finished hole dia. tolerance: ± 0.1 mm.
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Mechnical: 0.10 mm
Laser drill: 0.1 mm (0.07 mm possible)
Aspect ratio Through hole: 1:20
Plugging: with solder mask, copper, non conductive paste. Overplate possible.
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| Solder mask |
Color: Green
Bridge (F): 0.1 mm
Over size (C): 0.1 mm
Thickness, typical: 8-40µ
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Color: Red, white, black & blue
Bridge (F): 0.07 mm
Over size (C): 0.075 mm
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| Component printing |
Color: White
Minimum line width: 0.125 mm
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Color: Yellow & Black
Minimum line width: 0.1 mm
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| Data formats |
Macaos orders
Gerber Extended, drill files
ODB++
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Basic Gerber
pdf, doc, xls ect.
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Minimum distances:
– Npt – copper
– Outline – copper
– Scoring – copper
– Copper – copper
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See tables below
0.2 mm
0.4 mm
See tables below
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See tables below
0.1 mm
0.3 mm
See tables below
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Outer layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness |
Line width (D) |
Line space (E) |
NPTH – copper (G) |
| 18µ (43 plated)* |
150µ (100µ)** |
150µ (100µ)** |
200µ (150µ) |
| 35µ (70 plated) |
200µ (150µ) |
200µ (150µ) |
225µ (175µ) |
| 70µ (105 plated) |
300µ (250µ) |
300µ (250µ) |
250µ (200µ) |
| 105 (140 plated) |
400µ (300µ) |
400µ (350µ) |
300µ (250µ) |
| 140µ |
500µ (400µ) |
500µ (400µ) |
400µ (300µ) |
| 210µ |
600µ (500µ) |
600µ (500µ) |
500µ (400µ) |
| *) Commonly known as 35µ/1oz. |
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| **) Down to 50µ width/space on 9µ base copper. |
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Inner layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness |
Line width (D |
Line space (E) |
NPTH – copper (G) |
| 18µ |
125µ (75µ) |
125µ (75µ) |
(300µ) |
| 35µ |
150µ (100µ) |
150µ (100µ) |
(300µ) |
| 70µ |
250µ (200µ) |
250µ (200µ) |
(300µ) |
| 105 |
300µ (250µ) |
300µ (250µ) |
(300µ) |
| 140µ |
500µ (350µ) |
500µ (350µ) |
(400µ) |
| 210µ |
600µ (500µ) |
600µ (500µ) |
(500µ) |
Stenciler
| Maximum size |
595×595 mm |
| Thickness |
100, 120, 130, 150, 180, 200, 250µ |
| Treatment |
Electro polished |
| Etching |
Up to 2 thicknesses pr. stencil. Etch down in 10µ steps from base thickness.
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| Minimum opening size |
50µ |
| Minimum distance opening to opening |
150µ |
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