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Kapabilitet

I Elprint benytter vi stadigvæk vores velkendte MIX-princip, hvor standardopbygninger af 1-, 2-, og 4-lags print bliver mixet med andre print, der bærer samme specifikationer. Hermed opnår du en bedre udnyttelse af produktionspanelet og der er flere til at ”deles” om opstartsomkostningerne. Dette medfører, at du som kunde får lavere priser på print, som kan mixes. Her på siden kan du se vores kapabilitet - både hvad angår standard printkort på mix og vores generelle kapabiliteter for alle typer af printkort.

For at dit print kan mixes, skal det opfylde nogle krav, som er specificeret i boksen umiddelbart herunder.

For flere tekniske oplysninger kan du med fordel læse nærmere om printkort her på siden eller på www.macaos.com.

Hent en printervenlig PDF af vores kapabiliteter.
 

Kapabilitet – MIX

Production time Minimum 2 days
Shipment time 2 days
Base materials

FR4

FR4 High TG

Product range

1, 2 and 4 layer.

1.6 mm; 35 um copper in all layers.

4-layer have unspecified distance between layers.

Surface finish Lead-free HASL
Solder mask

Color: Green

Bridge: 0.1 mm

Over size (C): 0.1 mm

Component printing

White

Minimum 0.125 mm track width

Hole, minimum size (A) 0.30 mm
Conductor width (D) 0.125 mm
Conductor spacing (E) 0.125 mm
Annular ring (B) 0.15 mm
 
A Finished hole size. Plated or non plated
B Annular ring: (pad size – hole size) / 2
C Soldermask opening
D Conductor width
E Conductor spacing
F Solder mask bridge
G NPTH to copper

Generel kapabilitet

  Standard Special
Production standard IPC 6012C, Class 2

IPC 6012C, Class 3

Perfag

Any special requirements

Production time 5 days 1-2 days
Shipment time 2 days 1 day. 3 days -3 weeks on series
Base materials

FR4

FR4 High TG

Rogers

Aluminium core/carrier

Polyimide (flex & rigid)

Arlon

Product Range

Single sided, double sided

Multilayer

Prototypes

Small & large production series

High density interconnect (HDI)

Flex, Rigid-Flex

Metal core/carrier (Alu)

Impedance controlled PCBs

Board size

Min 25×25, if smaller PCB must be panelized

Max 500×600 mm

Max 520-720 mm??
PCB thickness 1.6 mm standard, ± 10%

FR4: 0.1 – 6.0 mm

Min. inner layer: 0.05 mm

Copper thickness

35µ

Plating: 20µ for IPC Class 2

12-200µ

Plating: 25µ for IPC Class 3

Surface finish

Lead free HASL

ENIG (chem. NiAu)

Silver

Chemical Tin

Hard Gold

HASL (Non RoHS, with lead)

Mechanical processing

Routing (2.4, 2.0, 1.6 mm)

Routing tolerance: ±0.20 mm

Scoring (PCB thicnkess: 0.8-2.4 mm)

Scoring, min dist. Copper: 0.4 mm

Min. routing tool: 0.6 mm dia.

Routing tolerance: ±0.10 mm

Plated edges

Depth controlled routing

Castellated holes (half moon holes)

Blind & buried vias

Peelable (blue) mask

Holes

Mechanical: 0.25-6.2 mm

Aspect ratio Through hole: 1:10

Aspect ratio blind hole: 1:1

Finished hole dia. tolerance: ± 0.1 mm.

Mechnical: 0.10 mm

Laser drill: 0.1 mm (0.07 mm possible)

Aspect ratio Through hole: 1:20

Plugging: with solder mask, copper, non conductive paste. Overplate possible.

Solder mask

Color: Green

Bridge (F): 0.1 mm

Over size (C): 0.1 mm

Thickness, typical: 8-40µ

Color: Red, white, black & blue

Bridge (F): 0.07 mm

Over size (C): 0.075 mm

Component printing

Color: White

Minimum line width: 0.125 mm

Color: Yellow & Black

Minimum line width: 0.1 mm

Data formats

Macaos orders

Gerber Extended, drill files

ODB++

Basic Gerber

pdf, doc, xls ect.

Minimum distances:

– Npt – copper

– Outline – copper

– Scoring – copper

– Copper – copper

See tables below

0.2 mm

0.4 mm

See tables below

See tables below

0.1 mm

0.3 mm

See tables below

 

Outer layer, copper thickness and line/space. Cheapest (Minimum)

 
Starting copper thickness Line width (D) Line space (E) NPTH – copper (G)
18µ (43 plated)* 150µ (100µ)** 150µ (100µ)** 200µ (150µ)
35µ (70 plated) 200µ (150µ) 200µ (150µ) 225µ (175µ)
70µ (105 plated) 300µ (250µ) 300µ (250µ) 250µ (200µ)
105 (140 plated) 400µ (300µ) 400µ (350µ) 300µ (250µ)
140µ 500µ (400µ) 500µ (400µ) 400µ (300µ)
210µ 600µ (500µ) 600µ (500µ) 500µ (400µ)
*) Commonly known as 35µ/1oz.      
**) Down to 50µ width/space on 9µ base copper.      

 

Inner layer, copper thickness and line/space. Cheapest (Minimum)

 
Starting copper thickness Line width (D Line space (E) NPTH – copper (G)
18µ 125µ (75µ) 125µ (75µ) (300µ)
35µ 150µ (100µ) 150µ (100µ) (300µ)
70µ 250µ (200µ) 250µ (200µ) (300µ)
105 300µ (250µ) 300µ (250µ) (300µ)
140µ 500µ (350µ) 500µ (350µ) (400µ)
210µ 600µ (500µ) 600µ (500µ) (500µ)


Stenciler

 
Maximum size 595×595 mm
Thickness 100, 120, 130, 150, 180, 200, 250µ
Treatment Electro polished
Etching

Up to 2 thicknesses pr. stencil. Etch down in 10µ steps from base thickness.

Minimum opening size 50µ
Minimum distance opening to opening 150µ
 Kontakt os
Du er velkommen til at kontakte os på telefon +45 44 36 04 00 eller via formularen herunder:
 
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Elprint ApS | Gammel Tjærebyvej 100 | 4000 Roskilde | Telefon (+45) 44 36 04 00 | CVR 16312207